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Kaga FEI America

Kaga FEI America

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DRAM

Etron offers standard DRAMs in different configurations, densities, speed, and voltage specifications.  The products are designed for and built on proven and highly reliable process technologies to achieve top reliability levels.

The company’s revolutionary reduced pin count RPC DRAM technology combines high performance with small footprint DRAM to reduce overall system costs for low power devices.  Target applications are consumer and IoT devices.

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About Etron

Etron Technology is a leading memory supplier based in Taiwan.  In addition to JEDEC standard memories, the company offers automotive and industrial grade DRAMs.  The company is also a leading supplier of Known Good Die memories (KGDM) for system-in-package (SIP) and multi-chip package (MCP) applications.

Known Good Die Memories (KGDM)

Please contact us for datasheet and detailed information

DDR2 SDRAM

DENORGMbps/pinVDD, INTERFACEPAD LOCATION
128Mb8Mx161066/800/6671.2V/1.8V2-side edge pad
256Mb16Mx161066/800/6671.8V2-side edge pad
512Mb32Mx161066/800/6671.5V/1.8V2-row central pad
512Mb32Mx161066/800/6671.8V2-side edge pad
1Gb64Mx161066/800/6671.5V/1.8V2-row central pad

LPDDR2 SDRAM

DENORGMbps/pinVDD, INTERFACEPAD LOCATION
256Mb8Mx321066/800/6671.2V, HSUL_122-side edge pad

DDR3 SDRAM

DENORGMbps/pinVDD, INTERFACEPAD LOCATION
512Mb32Mx161866/1600/13331.5V2-row central pad
1Gb64Mx161866/1600/13331.5V1-row central pad
512Mb32Mx161600/13331.35V2-row central pad
1Gb64Mx161600/13331.35V1-row central pad

DDR3 SDRAM

DENORGMbps/pinVDD, INTERFACEPAD LOCATION
512Mb32Mx161866/1600/13331.5V2-row central pad

JEDEC Standard DRAM

Please contact us for datasheet and detailed information

DDR2

DENORGPART NOGRADEMbps/pinVDD, INTERFACEPACKAGE
128Mb8Mx16EM68916CBQDCommercial Temp.1066/800/6671.8V, SSTL_1884-ball FBGA (BQ:8×12.5×1.2mm)
256Mb16Mx16EM68A16CBQCCommercial Temp.1066/800/6671.8V, SSTL_1884-ball FBGA (BQ:8×12.5×1.2mm)
512Mb32Mx16EM68B16CWQKCommercial Temp.1066/800/6671.8V, SSTL_1884-ball FBGA (WQ:8×12.5×1.2mm)
512Mb64Mx8EM68B08CWAHCommercial Temp.1066/800/6671.8V, SSTL_1860-ball FBGA (WA:8x10x1.2mm)
1Gb64Mx16EM68C16CWQGCommercial Temp.1066/800/6671.8V, SSTL_1884-ball FBGA (WQ:8×12.5×1.2mm)
1Gb128Mx8EM68C08CWAGCommercial Temp.1066/800/6671.8V, SSTL_1860-ball FBGA (WA:8x10x1.2mm)
2Gb128Mx16EM68D16CBQCCommercial Temp.1066/800/6671.8V, SSTL_1884-ball FBGA (WQ:8×12.5×1.2mm)
2Gb256Mx8EM68D08CWAACommercial Temp.1066/8001.8V, SSTL_1860-ball FBGA (WA:8x10x1.2mm)

DDR3

DENORGPART NOGRADEMbps/pinVDD, INTERFACEPACKAGE
512Mb32Mx16EM6GB16EWKACommercial Temp1866/1600/13331.5V96-ball FBGA(WK:8x13x1.0mm)
512Mb32Mx16EM6HB16EWKACommercial Temp1600/13331.35V96-ball FBGA(WK:8x13x1.0mm)
1Gb64Mx16EM6GC16EWXCCommercial Temp.1866/1600/13331.5V96-ball FBGA (WX:9x13x1.2mm)
1Gb64Mx16EM6GC16EWKGCommercial Temp.1866/1600/13331.5V96-ball FBGA (WK:8x13x1.0mm)
1Gb64Mx16EM6HC16EWXCCommercial Temp.1866/1600/13331.35V96-ball FBGA (WX:9x13x1.2mm)
1Gb64Mx16EM6HC16EWKGCommercial Temp.1866/1600/13331.35V96-ball FBGA (WK:8x13x1.0mm)
1Gb128Mx8EM6GC08EWUGCommercial Temp.1866/1600/13331.5V78-ball FBGA (WU:8×10.5×1.0mm)
1Gb128Mx8EM6HC08EWUGCommercial Temp.1866/1600/13331.35V78-ball FBGA (WU:8×10.5×1.0mm)
2Gb128Mx16EM6GD16EWBHCommercial Temp.1866/1600/13331.5V96-ball FBGA (WB:7.5x13x1.0mm)
2Gb128Mx16EM6HD16EWBHCommercial Temp.1866/1600/13331.35V96-ball FBGA (WB:7.5x13x1.0mm)
2Gb256Mx8EM6GD08EWAHHCommercial Temp.1866/1600/13331.5V78-ball FBGA (WA:7.5×10.5×1.0mm)
2Gb256Mx8EM6HD08EWAHHCommercial Temp.1866/1600/13331.35V78-ball FBGA (WA:7.5×10.5×1.0mm)
4Gb256Mx16EM6GE16EWAKGCommercial Temp.1866/16001.5V96-ball FBGA(WAK:7.5×13.5×1.2mm)
4Gb256Mx16EM6GE16EWAKGCommercial Temp.21331.5V96-ball FBGA(WAK:7.5×13.5×1.2mm)
4Gb256Mx16EM6HE16EWAKGCommercial Temp.1866/16001.35V96-ball FBGA(WAK:7.5×13.5×1.2mm)
4Gb512Mx8EM6GE08EW9GCommercial Temp.1866/16001.5V78-ball FBGA (W9:7.5×10.6×1.2mm)
4Gb512Mx8EM6GE08EW9GCommercial Temp.21331.5V78-ball FBGA (W9:7.5×10.6×1.2mm)
4Gb512Mx8EM6HE08EW9GCommercial Temp.1866/16001.35V78-ball FBGA (W9:7.5×10.6×1.2mm)

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Kaga FEI America
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