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Wireless Modules > Wireless LAN

WK8887AA1

Wireless LAN Module
  • Wireless Module Type

    Wireless LAN + Bluetooth Module

  • Status

    Active

  • Evaluation Board

    WK8887AA1-EVB

  • Evaluation Kit

    WK8887AA1-EVK

Product Specifications

  • Dimension (mm): 24.0 x 11.5 x2.0
  • Bluetooth Version: 4.2
  • Interfaces: PCM, SDIO
  • CPU: ARM Cortex M4
  • Crystal: yes
  • IEEE Spec: 802.11 ac/a/b/g/n
  • Certification: Japan U.S.A. Canada (CE)
  • ANT Support: yes

Additional Features

  • SMD type module.
  • IEEE802.11ac/a/b/g/n 1×1 conformity. Data rates up to MCS9(433.3Mbps)
  • Low standby current (with low power operation)
  • Transmit data rate : 11/5.5/2/1 Mbps(11b), 54/48/36/24/18/12/9/6 Mbps(11a/g), 150~6.5 Mbps (11n, MCS7~0, HT20/40), 433.3 ~ 7.22 Mbps (11ac MCS9~0, HT80 )
  • Channel Number : 1 to 13 channel (11bgn), W52/W53/W56/W58(11ac/11an), 79 channel (BT), 40 channel (BLE)
  • Security: TKIP, WEP, AES, CCMP, CMAC, WAPI, WPA/WPA2(64bit/128bit)
  • Outline: 24.0 x 11.5 x2.0 (Max) mm
  • Package: Metal case package
  • Japan, FCC and ISED qualified
  • CE conducted test report available
  • RoHS Conformity

Related Resources

Type Version Date
Datasheet 1 08/17/2023
FAQ 1.1 08/21/2023
ETSI Test Report
Radio Law FAQ 1.1 08/17/2023
Overview 1.1 08/21/2023
Application Note 1.1 08/17/2023
Eval Board Manual 1 08/31/2023
Module CAD Data 05/13/2023

Product Accessories

eval board image

WK8887AA1-EVB

Evaluation Board for WLAN module WK8887AA1 with SDIO interface. It is necessary to prepare PC with SDIO I/F.

eval kit image

WK8887AA1-EVK

Host processor (ESPRESSObin) is attached to this kit. It is not necessary to prepare PC with SDIO I/F.

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