- Dimension (mm): 24.0 x 11.5 x2.0
- Bluetooth Version: 4.2
- Interfaces: PCM, SDIO
- CPU: ARM Cortex M4
- Crystal: yes
- IEEE Spec: 802.11 ac/a/b/g/n
- Certification: Japan U.S.A. Canada (CE)
- ANT Support: yes
- SMD type module.
- IEEE802.11ac/a/b/g/n 1×1 conformity. Data rates up to MCS9(433.3Mbps)
- Low standby current (with low power operation)
- Transmit data rate : 11/5.5/2/1 Mbps(11b), 54/48/36/24/18/12/9/6 Mbps(11a/g), 150~6.5 Mbps (11n, MCS7~0, HT20/40), 433.3 ~ 7.22 Mbps (11ac MCS9~0, HT80 )
- Channel Number : 1 to 13 channel (11bgn), W52/W53/W56/W58(11ac/11an), 79 channel (BT), 40 channel (BLE)
- Security: TKIP, WEP, AES, CCMP, CMAC, WAPI, WPA/WPA2(64bit/128bit)
- Outline: 24.0 x 11.5 x2.0 (Max) mm
- Package: Metal case package
- Japan, FCC and ISED qualified
- CE conducted test report available
- RoHS Conformity
Evaluation Board for WLAN module WK8887AA1 with SDIO interface. It is necessary to prepare PC with SDIO I/F.
Host processor (ESPRESSObin) is attached to this kit. It is not necessary to prepare PC with SDIO I/F.